Whta Core Technology
At Whta Photonics, we specialize in Group IV semiconductor materials to develop state-of-the-art infrared solutions. These materials enable our chips to operate in the entire infrared spectra, from the Near Infrared (NIR) & Short-Wave Infrared (SWIR) range to the Middle-Wave Infrared (MWIR), offering superior sensitivity and performance. Leveraging CMOS-compatible technology, we deliver scalable, innovative and highly customizable solutions for advanced sensing and imaging applications. We are pioneering the future of optoelectronic devices, specifically focusing on the exploration and development of photodetectors and receptors based on semiconductor alloys. Due to their unique electronic and optical properties, Group IV semiconductors have been an area of immense interest for the scientific community. At Whta, we are at the forefront of this research, pushing the boundaries of what is achievable with these materials.
Technology features
Material
Silicon Integration
Silicon integration stands out for its compatibility with existing technological systems. It allows for the seamless incorporation of innovative materials into established infrastructures without requiring major changes to the production chain.
CMOS Compatibility
CMOS compatibility allows for the integration of innovative materials while utilizing standardized semiconductor manufacturing processes. This facilitates the production of more efficient and cost-effective devices, seamlessly integrating into existing production chains.
Chemical Vapor Deposition (CVD)
CVD is the industry standard for growing large semiconductor wafers. It deposits uniform material layers with precise control over thickness and composition, enabling mass production of high-quality electronic devices for modern applications like sensors and photonics.
Infrared (IR) Devices
High-speed photodetectors
Our technology enables the development of high-speed photodetectors capable of operating at frequencies exceeding 10 GHz. This breakthrough supports cutting-edge applications such as ultra-fast optical communication systems, high-resolution imaging, and advanced LIDAR technologies.
Covered IR spectra
Our innovative material is capable of covering the entire infrared spectrum, ranging from near-infrared (NIR) to mid-infrared (MIR) and far-infrared (FIR). This versatility enables a wide range of applications, such as gas detection, thermal imaging, and telecommunications.
On-Chip Communication
On-chip communication technology enables ultra-fast data exchange within integrated circuits. It boosts speed, reduces interference, and optimizes energy use, ideal for compact, high-performance devices.